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13 Jul 2014

11bgas

by Henrik’s Blog @ hforsten.com:

All of the best integrated circuits today come in hard to solder BGA packages. Because BGA packages have connections under the chip soldering is harder and it needs to be done using a reflow oven or hot plate. Another problem is with designing the PCB, vias and traces need to be small enough to fit between the solder balls and there needs to be usually quite many layers in the board to make room for all the closely packed traces. This means that a cheap Chinese two layer board doesn’t have enough room and more layers are needed. Adding layers increases the cost of the board dramatically when ordering only a few copies.

Making embedded Linux computer – [Link]

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