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15 Jul 2015

150709edne-fujitsu-bild_pr_fram_1

by Graham Prophet @ edn-europe.com:

Fujitsu has used an ultra small package for this memory part, which it presents as a solution for power-critical miniature applications in sensor and wearable markets.

The 1Mbit SPI FRAM is in an 8-pin wafer level chip scale package (WL-CSP) which is an additional package variant to the existing product MB85RS1MT. In comparison to the industry standard SOP-8 package, the new WL-CSP package, which measures 3.09 x 2.28 x 0.33 mm, reduces the surface mounting area by 77%, and the device height by 80%.

1Mbit SPI FRAM comes in chip-scale packaging – [Link]



 
 
 

 

 

 

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